New material promises 100 times more heat dissipative power
Vineet Chauhan , shimla: Jul 17 2009
Made Popular Jul 17 2009
Scientists at Georgia Tech Research Institute (GTRI) have broken the ice in developing a heat dissipating material for ultra-high-power defense electronics. This new-fangled material is a composite of diamond and copper and a part of new concept called...
Add Images and Videos
Close X
Recommended Tags or Keywords
Search by Tags or Keywords
Selected Media ( You can Upload only Six media )
Sorry no picture found for this combination of tags. Try to search minimum number of tags at once
Add your Comment